On 29 July 2026, the DSAC welcomed representatives from Cadence Design Systems for a working meeting to exchange the signed Memorandum of Understanding (MoU) and discuss future collaboration in integrated circuit (IC) design education and workforce development in Da Nang.

During the meeting, DSAC shared its key achievements in semiconductor training and talent development in 2026, as well as its training plans for the second half of the year. The two parties also discussed priority initiatives following the MoU, including the implementation of specialized training programs, support for EDA tools to facilitate the 3rd Smart City IC Design Competition in Central Vietnam, and enhanced knowledge sharing and expert engagement.

Through this partnership, DSAC and Cadence aim to jointly develop high-quality training programs that strengthen Vietnam’s IC design talent pipeline and support the growing needs of the semiconductor industry. The collaboration also lays the foundation for closer connections between academia and industry, contributing to the development of an innovative semiconductor ecosystem in Da Nang and across Vietnam.