Mr. Hồ Quang Bửu, Member of Da-Nang Municipal, Vice Chairman of the People’s Committee of Da-Nang, delivering his closing remarks

Morning Session – Platform Technologies for Future Society: The Convergence of Electronics and Photonics:

The morning session highlighted the latest advances in two core technologies: electronics and photonics. The session opened with welcome addresses by:

• Mr. Lương Nguyễn Minh Triết, Alternate Member of the Central Committee of the Communist Party of Viet-Nam, Deputy Secretary of Da-Nang Municipal, Chairman of the People’s Committee of Da-Nang

• Assoc. Prof. Dr. Vũ Hải Quân, Member of the Central Committee of the Communist Party of Vietnam, President of Vietnam National University Ho Chi Minh City

• Mr. Marc Knapper,  Ambassador of the United States of America to Vietnam

• Assoc. Prof. Dr. Lê Thành Bắc, Vice President of the University of Danang

• Dr. Lê Thái Hà, Managing Director, VinFuture Foundation

The session continued with in-depth presentations, including:

• Dr. Shu Namiki (Assistant Director General, Department of Electronics and Manufacturing, National Institute of Industrial Science and Technology (AIST), Japan): Technological trends and silicon photonics for the future digital infrastructure

• Ms. Bich-Yen Nguyen (Senior Fellow, Soitec (USA)): From Transistors to Intelligence: The Emerging Role of Advanced Packaging and Photonic Integration in AI Era

• Assoc. Prof. Dr. Nguyen Tan Hung (Acting Vice Director, Institute of Advanced Science and Technology, University of Danang): Low-Power, High-Density Photonic Interface for Artificial Intelligence and Machine Learning (AI/ML)

• Dr. Tatsuro Maeda (Research Manager, National Institute of Industrial Science and Technology (AIST), Japan): Frontiers in Semiconductor Technology: AIST’s Strategic Research Initiatives

• Ms. Linda Tan (President of SEMI Southeast Asia): Powering Vietnam’s Semiconductor Ambition

• Dr. Le Quang Đam (General Director at Marvell Technology Vietnam): Marvell’s Silicon Photonics Technology: High-Speed Interconnect in Artificial Intelligence and Cloud Data Centers

A panel discussion on “Connecting R&D – Pilot Production – Commercialization: Opportunities for Developing Photonic Chips and Advanced Packaging in Da Nang”, moderated by Mr. Lê Hoàng Phúc, Director of DSAC, featured experts from AIST (Japan), IEEE (USA), Marvell, and global electronics associations. The discussion emphasized the importance of international collaboration, investment in cleanroom infrastructure, and the Lab-to-Fab model to accelerate research into practical applications. Experts highlighted the crucial role of government direction and support in creating a favorable environment for enterprises and fostering the semiconductor ecosystem in Vietnam.

Afternoon Session – Seminar “Connecting supply chains and cleanroom infrastructure solutions for semiconductor chip production and packaging in Viet Nam”:

The afternoon session opened with remarks from: Dr. Võ Xuân Hoài, Deputy Director of the National Innovation Center (NIC) and Dr. Bruno Wu, Chairman of Sun Seven Stars Investment Group. Key presentations included:

Mr. Hoa Dang Tran (Chairman of FPT IS, FPT Corporation): FPT’s Journey in Building a Semiconductor Ecosystem – From Human Resources to “Made in Vietnam” Chips

Mr. Ding Ming Chee (Senior Director, ASEAN Customer Solution Experience (CSE), Dassault Systemes, Asia Pacific South): Digital Twin application in semiconductor human resource development

Dr. Andrei Uvarov (R&D Director of Corial, Plasma-Therm (France)): Solutions to improve the R&D capacity of next-generation technologies in the semiconductor sector

Mr. Sean Kim (Vice President, CoAsia Semi Korea): Customised DRAM in 3D packaging – AI memory trends for edge AI applications

Mr. Tomoyuki Maeda (General Director, YS Talent Company): Strengthening sustainable cooperation between Da Nang and Japan on human resource development and investment opportunities for startups and innovation in the fields of semiconductors and AI

Assoc. Prof. Mai Anh Tuan (Senior Lecturer, University of Engineering and Technology – Vietnam National University, Hanoi; Industrial Consultant, Department of Industry, Ministry of Industry and Trade) addressed critical issues such as equipment reuse, licensing for chip design, server infrastructure, and strategies for mobilizing equipment sponsorship through partnerships with enterprises.

Within the framework of the event, seven Memoranda of Understanding (MoUs) were exchanged, focusing on workforce training and development in semiconductors and artificial intelligence. Partners included Plasma-Therm, FPT, DSAC, akaVers, YS Talent, VNUK, and SEVINA, creating a foundation for advancing the semiconductor ecosystem in Da Nang.

Da Nang Semiconductor Day 2025 concluded with significant milestones in cooperation and innovation. The city looks forward to welcoming the global technology community back in future events, reaffirming Da Nang’s position as an emerging hub for semiconductors and artificial intelligence in Vietnam.